Snapdragon 875 will be released in December

Snapdragon 875 will appear earlier than its predecessors were released. Qualcomm has confirmed that it will be officially released on December 1st. The first smartphone with this integrated chip will appear on the market in January 2021, which is at least 2 months earlier than in previous years.

No wonder Samsung Galaxy S21 is the world's first Snapdragon 875 phone. And Xiaomi Mi 11 will be the first to launch Snapdragon 875 in China. The first batch of Qualcomm Snapdragon 875 manufacturers include Xiaomi (including Redmi, Black Shark), VIVO (including iQOO), BBK (OPPO, Realme, OnePlus), etc.

The Qualcomm Snapdragon 875 will use the EUV process – Samsung's 5nm LPE process. In addition, it will use an eight-core three-cluster "1 + 3 + 4" architecture. One large core will be clocked at 2,84GHz, 3 A78 cores will be clocked at 2,42GHz, and 4 A55 cores will be clocked at 1,8GHz.

Additionally, the Snapdragon 875 GPU is upgraded to Adreno 660. This chipset will use the Qualcomm Secure Processing Unit (SPU250), Spectra 580 image processor and Snapdragon Sensors core technology. In terms of connectivity, the Qualcomm SD875 supports external 802.11ax, 2 × 2 MIMO and Bluetooth Milan. This chipset also supports 3G / 4G / 5G modems - millimeter waves (mmWave) and frequency bands below 6 GHz.

However, it is worth saying that Qualcomm has already started work on the flagship chip of the next generation. Snapdragon 885 will appear later in 2021. Obviously, the current specifications are unknown, but it will continue to use Samsung's 5nm process and may be an improved version of the 5nm LPP process.

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As for the 895 Snapdragon 2022, there are no detailed specifications. But the technological process will change. Qualcomm will most likely return to TSMC foundries for this generation of chips, as it did with the Snapdragon 855/865.

The Snapdragon 895 will most likely use TSMC's 4nm process. In fact, this is an improved version of the 5nm process. The design is compatible with 5nm, and there will be more EUV mask layers. However, performance and power consumption will change greatly.

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